BTQ Technologies and ICTK Unveil Next-Gen Quantum Security Chip

• •BTQ and ICTK have completed the design of a next-generation quantum security chip.
• •The chip combines BTQ's QCIM technology with ICTK's VIA PUF™ for enhanced device authentication.
• •Production preparations are underway following a $15 million joint investment agreement.

BTQ Technologies Corp. and ICTK Co., Ltd. announced the completion of their next-generation QCIM + PUF security chip design on July 10, 2026. This chip integrates BTQ's Quantum Compute-in-Memory (QCIM) technology with ICTK's VIA PUF™ technology, aimed at enhancing hardware-rooted authentication for IoT and AI devices. The chip is designed to support unique device authentication, cryptographic acceleration, and trusted device identity. Preparation for production is currently underway. The collaboration builds on a memorandum of understanding signed in May 2025, which was expanded by a $15 million joint investment agreement in October 2025. The chip is expected to address the growing need for security in connected infrastructure, particularly in high-assurance networks. The development is part of BTQ's strategy to secure mission-critical networks in the quantum era.